Intel Corporation has completed the development stage of manufacturing process of the next chip generation by pressing the size of circuits to 32 nanometer (one per billion meters). Intel, according to the schedule, has been ready to produce the future generations of transistor that a more efficient, more compact and with higher performance in the fourth quarter of 2009.
Intel will provide more technical details about the 32 nm process technology and also carries several other topics in a presentation on 'International Electron Devices Meeting (IEDM) weeks in San Francisco. With the completion of stage 32 nm process technology and the readiness to produce in this period of time, Intel keep the tempo to introduce new production processes and in accordance with the ambitions and strategy of 'tick-tock' from Intel.
Intel will introduce a new processor with microarchitecture with the manufacturing process leading every 12 months, an effort that does not understand in this industry. With 32 nm chip production next year, this marks the achievement of Intel in meeting the target for four consecutive years. Intel's 32 nm technology heard regarding the technology of high-k + metal gate second-generation, 193nm immersion lithography to create patterns in the layers to path and increase the critical techniques transistor density. This feature improve performance and energy efficiency of Intel processors. Intel's manufacturing process has the best performance transistor transistor density and the highest 32 nm technology from other existing in this industry.
